Function：

1、Motor drives synchronizing wheel and synchronous belt to transport the cards, there are two belts for transportation which can avoid card surface scratch. 

2、Double card detection sensor ensure feeding one card at one time.

3、Color sensor detection ensure card in the correct direction.

4、There are two milling groups can milling cavity layers at the same time or separately, just select on HMI.

5、 Professional fixture design, different thickness of the card can be adjusted the Milling depth.

6、There are two types of cleaners, first in the milling group by air flowing, second is cleaning station which use brush to suck the dust again, ensure the clean cavity for module embedding. 

7、Card carrying station move the cards from double card operation belt to single card operation belt.

8、Copper And Antenna Connection Checking Station can check if copper and antenna is connection or not, if no connection, this card will be not embed the module.

9、Cavity depth detection station can check if the cavity depth in the specified range or not after milling.  

10、 Glue dispensing station with High precision controller to control the glue injection quantity, also with cooling device can keep the conductive glue always in low temperature status to prevent glue solidified and inject failure. 

11、There is an OCR after glue dispensing station, it can check the conductive glue dispensing quantity, position and appearance is meet the specified requirement or not, if meet the requirement, this card will be moved to next working station, otherwise this card will be rejected.

12、IC strip step drive by servo and monitor by electric eye , easy to adjust, step accurate.

13、 IC strip with automatic feeding group and waste strip collection group.

14、Hot melt glue tape with automatic feeding group and waste tape collection group.

15、 With hot melt glue tape punching station and glue tape with IC strip lamination station.

16、 Chip transfer using servo to drive high-guide rails, screw. Transfer position can modify the parameter directly.

17、Hot welding uses a unique structure. Multi-group hot welding to ensure the quality of embedding.

18、. Check if there is chip on card base before hot welding , if no chip, not embedding.

19、Hot welding with cold welding function. Cold welding have cooling water function, to ensure that the back of the card after the card without trace.

20、Hot welding head with X, Y direction fine-tuning function.

21、There is a module height detection device in the cold welding station which can check the height between module surface and card surface, if the height in the specified range, the card will be collected in the output magazine, otherwise this card will be moved to rejection box.

22、Machine has ATR and Contactless card reader both testing, ensure Dual interface card function pass rate.

23、There is an OCR after ATR checking station, it can check the appearance of module  embedding. If checking result is good, this card will be collected to output magazine, If checking result is not good, the card will be rejected to rejection box.

24、Waste card separate collection group can be collected the card according to 4 defects, which include no milling cavity on slot, glue dispensing not meet requirement, no IC embedding on card and module appearance checking is not meet the requirement. 

25、Conveying arm sucked the card into card output magazine which can check the front side of card each time.

TECHNICAL PARAMETER

Control：Industrial PC  

Voltage：AC 380V  50 / 60 Hz 20A

Power：12 KW

Air Pressure：6㎏/C㎡

Speed：For DI card with tin technology is about 2500-2800cards/h

For DI card with conductive glue technology is about 3200 cards/h.

For normal card is about 4000 cards/h.

Dimension：(L)4220*(W)950*(H)1910 mm

Weight：3000kg

Module punching accuracy：±0.05mm

Milling position accuracy：+/-0.05mm

Milling depth：±0.015~±0.02mm

Milling size：±0.05mm

Embedding position accuracy：±0.05mm

Embedding Flatness accuracy：+0.05mm, -0.1mm

Embedding Head Temperature adjustment range：25℃～300℃

The temperature difference between the actual temperature of the welding head and the display temperature of the equipment are：Less than10℃

Temperature fluctuation range：±10℃

Applicable materials：Hot melt glue tape, Laminated strip module with ISO standard, 0.68~0.8mm thickness ISO lamination PVC, ABS card. 

Operator：1 person

Pass Rate：99.8%

Equipped with machine：Vacuum Cleaner (one set)      Chiller (one set)