Features◆YMJ-WB-30K-N is a device designed forthe RFID industry of IOT, HF, UHF Inlay chip assembling. Machine suitable forthe antenna width of 20-180mm.◆The whole line is automatic loading, materialstepping, glue dispensing, chip attaching, hot pressing, detecting, marking andunloading. It suitable for 8-inch or 12-inch wafer.◆The chip attachin…

Full auto RFID Flip Chip Assembling Machine adopt the flip chip on board technology to produce the RFID inlays, through high-precision modular mechanism, pick the chip from wafer, then place on pre-dispensing conductive glue with hot press, solidify wafer on the etched antenna, to conduct chip and substrate antenna, so that achieve RFID Inlay bondi…