customer service hotline
0755-27918093-8012
This machine can suit for conductive glue, tin paste, conductive glue tape, contact IC technology. Conductive glue technology: Machine can achieve the function of milling, dust cleaning, glue dispensing, pre-welding, module punching, chip embedding, OCR checking, bad card separate collecting. Tin paste technology: Machine can achieve the function of milling, dust cleaning, tin paste dispensing, glue tape laminating, pre-welding, module punching, chip embedding, OCR checking, bad card separate collecting. different technologies can be selection.
Technical Parameter:
| Overall Dimension： | L4100mm*W900mm*H1850mm |
| Weight： | 2500KG |
| Power Supply： | 3 phase AC380V 50/60HZ |
| Power： | 12KW |
| Air Supply： | 6KG/cm² |
| Air Consumption： | 800L/min |
| Control System： | PC |
| Applicable Materials： | Hot melt glue tape, Laminated strip module with ISO standard,0.68-0.8mm thickness ISO lamination PVC,ABS card. |
| UPH： | For DI card with tin paste technology is 2500-2800 cards/h; For DI card with conductive glue technology is 3200cards/h; For normal card is 4000 cards/h; |
| Yield： | 99.80% |
| Module Punching Accuracy： | ±0.05mm |
| Milling Position Accuracy： | ±0.05mm |
| Milling Depth： | ±0.015 ~ ±0.02mm |
| Milling Size： | ±0.05mm |
| Embedding Position Accuracy： | ±0.05mm |
| Embedding Flatness Accuracy： | ±0.05mm |
Tel：+86-755-27918093/23060983
Fax：+86-755-27918086
Add：Building B, Hongxing Xifang Industrial Park,Datianyang,
Songyu Road, Songgang Street,Bao'An District,
Shenzhen, 518105, China
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