Full auto RFID Flip Chip Assembling Machine adopt the flip chip on board technology to produce the RFID inlays, through high-precision modular mechanism, pick the chip from wafer,  then place on pre-dispensing conductive glue with hot press, solidify wafer on the etched antenna, to conduct chip and substrate antenna, so that achieve RFID Inlay bonding.  Precise vision system make sure accurately positioning and monitor the RFID chip and antenna bonding. Integrate with glue dispensing, chip pick and placement, transportation, hot press, testing and unloading.